? 2015 littelfuse, inc. specifcations are subject to change without notice. revised: 11/20/15 the 3.0smc series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. description maximum ratings and thermal characteristics (t a =25 o c unless otherwise noted) parameter symbol value unit power dissipation on infnite heat sink at t l =50 o c p d 6.5 w peak forward surge current, 8.3ms single half sine wave (note 1) i fsm 300 a maximum instantaneous forward voltage at 100a for unidirectional only v f 3.5 v operating temperature range t j -65 to 150 c storage temperature range t stg -65 to 175 c typical thermal resistance junction to lead r jl 15 c/w typical thermal resistance junction to ambient r ja 75 c/w notes: 1. measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. tvs devices are ideal for the protection of i/o interfaces, v cc bus and other vulnerable circuits used in telecom, computer, industrial and consumer electronic applications. applications features ? for surface mounted applications in order to optimize board space ? low profle package ? typical failure mode is short from over-specifed voltage or current ? whisker test is conducted based on jedec jesd201a per its table 4a and 4c ? iec-61000-4-2 esd 30kv(air), 30kv (contact) ? i pp is specifed @ 8/20s surge waveform ? built-in strain relief ? v br @ t j = v br @25c x (1+ t x (t j - 25)) ( t:temperature coeffcient, typical value is 0.1%) ? glass passivated chip junction ? fast response time: typically less than 1.0ps from 0v to bv min ? excellent clamping capability ? low incremental surge resistance ? high temperature to refow soldering guaranteed: 260c/40sec ? meet msl level1, per j-std-020, lf maximun peak of 260 c ? matte tin leadCfree plated ? halogen free and rohs compliant ? pb-free e3 means 2nd level interconnect is pb-free and the terminal fnish material is tin(sn) (ipc/jedec j-std- 609a.01) 3.0smc series functional diagram bi-directional uni-directional cathode anode uni-directional r ohs pb e3 datasheet additional infomarion resources samples transient voltage suppression diodes surface mount > 3.0smc series
? 2015 littelfuse, inc. specifcations are subject to change without notice. revised: 11/20/15 tvs diode arrays (spa ? family of products) electrical characteristics (t a =25c unless otherwise noted) part number (uni) marking reverse stand off voltage v r (volts) breakdown voltage v br (volts) @ i t test current i t (ma) maximum clamping voltage v c @ 8/20s i pp (v) maximum peak pulse current i pp @ 8/20s (a) maximum reverse leakage i r @ v r (a) min max 3.0smc20a yla 20.0 22.20 24.50 1 42 570 1 3.0smc24a ylc 24.0 26.70 29.50 1 51 520 1 3.0smc28a yle 28.0 31.10 34.40 1 59 470 1 3.0smc30a ylf 30.0 33.30 36.80 1 62 420 1 3.0smc33a ylg 33.0 36.70 40.60 1 70 365 1 i-v curve characteristics vo lt age tr an si en ts ti me vo lt age acro ss tv s current through tv s voltage or current figure 1 - tvs transients clamping waveform ratings and characteristic curves (t a =25c unless otherwise noted) figure 2 - peak pulse power rating 0. 1 1 10 100 1000 0. 001 0. 01 0. 11 p ppm -peak pulse power (kw ) 10 0. 31x0 .3 1" (8 .0 x8 .0 mm) co pper pa d ar ea t d -p ul se wi dt h ( ms) t j initial = t amb vc v br v r i r i t i pp v uni-directional v f p ppm peak pulse power dissipation -- max power dissipation v r stand-off voltage -- maximum voltage that can be applied to the tvs without operation v br breakdown voltage -- maximum voltage that fows though the tvs at a specifed test current (i t ) v c clamping voltage -- peak voltage measured across the tvs at a specifed ippm (peak impulse current) i r reverse leakage current -- current measured at v r v f forward voltage drop for uni-directional continues on next page. transient voltage suppression diodes surface mount > 3.0smc series
? 2015 littelfuse, inc. specifcations are subject to change without notice. revised: 11/20/15 tvs diode arrays (spa ? family of products) i pp - p eak p ulse cur rent, % i pp 0 0 50 10 0 t r=8s p eak v alue half v alue t d=20s t-t ime ( s ) w aveform = t r x t d t r = rise time to peak value t d = decaytime to half value 1 10 100 1000 1000 0 100000 11 01 00 cj (pf) v br -r ev er se br ea kd ow n vo lt ag e( v) un i- di re c on al v= 0v un i- di re c on al v =v r figure 4 - pulse waveform figure 5 - typical junction capacitance 0 50 100 150 200 250 300 350 11 0 100 if sm - p ea k fo rw ar d su rv e cu rre nt (a ) nu mb er of cy cl es at 60 hz figure 7 - maximum non-repetitive peak forward surge current uni-directional only ratings and characteristic curves (t a =25c unless otherwise noted) (continued) figure 3 - peak pulse power derating curve 0 20 40 60 80 100 02 55 07 5 100 125 17 5 peak pulse power (p pp ) or current (i pp ) derating in percentage % 150 t j - initial junction temperature (oc) 0. 01 0. 1 1 10 100 0. 0010 .0 10 .1 11 0 100 100 0 tr an sien t th erma l im pe da nc e ( c/ w) t -p ul se du rati on (s ) p figure 6 - typical transient thermal impedance 0. 1 1. 0 10.0 100. 0 0. 01 .0 2. 03 .0 4. 05 .0 i f - p ea k fo rw ar d cu rr en t( a) v f -p ea k fo rw ar d vo lt ag e( v) figure 8 - peak forward voltage drop vs peak forward current (typical values) transient voltage suppression diodes surface mount > 3.0smc series
? 2015 littelfuse, inc. specifcations are subject to change without notice. revised: 11/20/15 tvs diode arrays (spa ? family of products) physical specifcations weight 0.007 ounce, 0.21 grams case jedec do214ab. molded plastic body over glass passivated junction polarity color band denotes positive end (cathode) except bidirectional. terminal matte tin-plated leads, solderable per jesd22-b102 dimensions dimensions inches millimeters min max min max a 0.114 0.126 2.900 3.200 b 0.260 0.280 6.600 7. 11 0 c 0.220 0.245 5.590 6.220 d 0.079 0.103 2.060 2.620 e 0.030 0.060 0.760 1.520 f - 0.008 - 0.203 g 0.305 0.320 7.750 8.130 h 0.006 0.012 0.152 0.305 i 0.129 - 3.300 - j 0.094 - 2.400 - k - 0.165 4.200 l 0.094 - 2.400 - soldering parameters te mperature (t ) ti me (t) t s(min) t s(max) t l t p t s prehea t t l t p ramp-up critical zone t l to t p ramp-dow n t 25?c to peak 25?c refow condition leadCfree assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus temp (t a ) to peak 3c/second max t s(max) to t a - ramp-up rate 3c/second max refow - temperature (t a ) (liquidus) 217c - time (min to max) (t s ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c (all dimensions in mm) i l k j solder p ads environmental specifcations high temp. storage jesd22-a103 htrb jesd22-a108 temperature cycling jesd22-a104 msl jedec-j-std-020, level 1 h3trb jesd22-a101 rsh jesd22-a111 do-214ab (smc j-bend) b f g h e c d a cathode band transient voltage suppression diodes surface mount > 3.0smc series
? 2015 littelfuse, inc. specifcations are subject to change without notice. revised: 11/20/15 part numbering system packaging options part marking system v r vo lta ge 5% v br vo lta ge t olerance series 3.0smc xx a part number component package quantity packaging option packaging specifcation 3.0smcxxx do-214ab 3000 tape & reel - 16mm tape/13 reel eia std rs-481 tape and reel specifcation 0.47 (1 2.0) 0.1 57 (4.0) 0.1 57 (4.0) 0.49 (1 2.5) 0.80 (20.2) arbor hole dia. 1 3.0 (330) dimensions are in inc hes (and millimeter s). direction of f eed 0.059 dia (1 .5) co ver tape cathode f xxx ymxxx marking code trace code marking y:year code m: month code xxx: lot code littelfuse logo cathode band transient voltage suppression diodes surface mount > 3.0smc series
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